DSP Group to Release Cordless VoIP Chip

January 3, 2005

 

DSP Group’s Cordless VoIP chip will combine VoIP, traditional TDMA, and digital cordless functionality on single silicon die.

DSP Group, Inc (NASDAQ:DSPG) announced the release of its Cordless VoIP chip this week. Designed to support digital cordless multi-handset applications with multiple VoIP lines and traditional telephony without additional costs, the chip is expected by DSP to create a new residential application for VoIP.

DSP Group is a fabless semiconductor company specializing in chipset solutions for the residential convergence of voice, data & video over broadband and wireless.

Its in-house technologies include DSPs, a portfolio of wireless communication protocols including DECT, Bluetooth and WiFi, and advanced radio frequency CMOS and SiGe ICs, as well as VoIP ICs.

DSP Group ICs are also widely used in MP3 players, VoIP phones, gateways, and IADs and DVRs (Digital Voice Recorders).

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